Thursday, 6 September 2012
Rapberry Pi Now made in the UK
Mike Buffham, Global Head of EDE at Premier Farnell commented: “When it came to reviewing our manufacturing strategy we were always keen to bring the production of the Raspberry Pi to the UK. From the outset Sony UK Technology Centre demonstrated its enthusiasm for the product as well as its expertise in manufacturing. Their site is highly impressive and I am very confident that the team in Wales can deliver, providing us with a high-quality product, within our designated timeframe, all within budget. The Sony brand is known for its quality and to have its broadcast manufacturing site on board and building the Raspberry Pi product, within the UK, is very exciting.
“Since the Raspberry Pi was launched globally in February 2012 it has been a tremendous success story. The younger generation have been fascinated in learning how to build and programme their own computer device. As such we have had huge interest from educational institutions in purchasing the product, innovative design engineers who are using the computer for exciting new applications and also the general public.”
Eben Upton, Co-Founder of the Raspberry Pi Foundation said: “When Pete Lomas and I built the first Raspberry Pi’s for testing last year, we never dreamed it would become so popular so quickly. The Raspberry Pi was built to develop young people’s skills in computer programming and electronic engineering; we had always intended and hoped that the Raspberry Pi would also be manufactured within the UK. We’re really delighted that Premier Farnell has been able to find such a reliable manufacturer as the Sony UK Technology Centre. By bringing the production of a UK product back into the country alongside its development and distribution, we can help support our economy and demonstrate the capabilities the UK has in terms of technological innovation, invention, and manufacturing.
“We look forward to continuing our work with Premier Farnell and now, the Sony UK Technology Centre, in the Raspberry Pi Foundation’s next stage of growth.”
In the assembly of the Raspberry Pi, Sony UKTec will be investing in additional equipment to fulfil the order requirements, providing flexibility and scalability to cater for potential increases in demand. This will include additional automated circuit board equipment and double side reflow machinery. Furthermore, the site will be extending its manufacturing process capability to include a technique called package-on-package (PoP). This process allows the processor and memory to be stacked on top of each other, reducing the PCB footprint and the distance that high-speed signals need to travel, improving overall reliability.